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ONTO INNOVATION

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ONTO INNOVATION
REGISTERED

on 23 Sept 2024

TM5 Status

LIVE/REGISTRATION/Issued and Active

Your registration has been issued and is active. You can now use the TM5 mark.

Last Applicant/ Owned by

ONTO INNOVATION INC.

16 Jonspin RoadWilmington MA 01887

US

Serial Number

2023842 filed on 12th Nov 2019

Registration Number

TMA1257557 registered on 23rd Sept 2024

Registration expiry Date

12th Nov 2029

Correspondent Address

BORDEN LADNER GERVAIS LLP

Bay Adelaide Centre, East Tower22 Adelaide St. WestTORONTO

ONTARIO

CA

M5H4E3

ONTO INNOVATION

Trademark usage description

lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates inc Read More

Classification Information

Class [007]
Lithography machines for the manufacture of microelectronics, integrated circuits, light emitting diodes, and semiconductors on laminar substrates including wafers, glass panels, and packaging panels such as copper plate or plastic; optical metrology, characterization, and inspection systems comprised of a machine, machine components and operating software therefor sold as a unit for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling; optical metrology, characterization, and inspection systems comprised of a machine and machine components and pre-installed operating software therefor sold as a unit for use in the production of precision machined optical surfaces, optical coatings, and optical assemblies including reference flat, sphere, asphere and assemblies composed of both refractive and reflective components.

Classification kind code

11

Class [009]
Optical metrology, characterization, and inspection systems comprised of pre-installed operating software and machine components therefor sold as a unit for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; interferometers for use in the testing of transmitted wavefront and surface shape of optical components, surface roughness of optics, metals, semiconductors, ceramics, plastics, paints and other finely finished materials, and defects and geometries of parts in aerospace, automotive, power generation, semiconductor, data storage, bearings, additive manufacturing and other precision-machined components; downloadable software, namely, process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors, and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling.

Classification kind code

11

Class [042]
Providing temporary use on online, nondownloadable process control and defect analysis software for use in the production of laminar substrates namely discrete electronic components, semiconductors including non-volatile and volatile memory devices, foundry and logic devices, asic devices, cmos image sensors, microelectromechanical systems, light emitting diodes, and other micro and nano technology devices, namely transistors, capacitors, resistors and inductors, advanced packaging electronics technologies, namely system -in -package (SIP) and fan-out packages, chiplets, heterogeneous packaging namely packaging comprising two different substrates, hybrid bonding, bumping, 3D structures, and scaling.

Classification kind code

11

Mark Details

Serial Number

2023842

Mark Type

Trademark

Legal History

Show more

Action TakenStatus
Submitted for opposition 22
on 16th Aug 2021		Search Recorded
Submitted for opposition 20
on 16th Aug 2021		Examiner's First Report
Submitted for opposition 223
on 16th Aug 2021		Total Provisional Refusal
Submitted for opposition 256
on 23rd Feb 2021		Notification of Possible Opposition Sent
Submitted for opposition 80
on 13th Jan 2021		Change of Title Registered
Submitted for opposition 257
on 23rd Apr 2020		Designation Notification - Madrid Protocol
Submitted for opposition 1
on 22nd Apr 2020		Created
Submitted for opposition 31
on 22nd Apr 2020		Formalized
Submitted for opposition 228
on 12th Nov 2019		International Registration
Submitted for opposition 30
on 12th Nov 2019		Filed